Heat Dissipation Performance – Comparison of DPGA and Others –

【Testing Conditions】

Temperature: 45 min. after turning the LED on (Celsius)

LED: REBEL (Philips Lumileds)

Wattage: 3.4W

RESULT

ResultDPGA PCBsAluminum PCBHeat Conduction CEM3FR-4
Initial Temperature22°C22°C22°C22°C
45 min. after turning power on47°C61°C111.5°C132.5°C
Temperature Rise25°C39°C89.5°C110.5°C
Thermography after 45 min

Comparison of Temperature Rise

Less than one-third of the temperature rise compared to heat conduction CEM3. Therefore, the following advantages can be expected: High heat dissipation of the PCB itself enables:

  • Reduction of heat sink size.
  • Lowering of junction temperature.
  • Higher luminance and longer life.

Reduction of Heat Sink Size and Unit Size

Unit capacity to contain the heat sink that can keep the LED temperature up to 74°C

:The capacity can be reduced to 44% by using DPGA.

In case the LED temperature is 74°C:

Unit capacity with aluminum PCB = 72 cm³
Unit capacity with DPGA PCB = 32 cm³

PCB/UNIT CAPACITY18 CUBIC CENTIMETERS32 CUBIC CENTIMETERS50 CUBIC CENTIMETERS72 CUBIC CENTIMETERS
DPGA82 DEGREES CELSIUS73.4 DEGREES CELSIUS67.5 DEGREES CELSIUS64.7 DEGREES CELSIUS
ALUMINUM PCB95.7 DEGREES CELSIUS88 DEGREES CELSIUS80 DEGREES CELSIUS74.4 DEGREES CELSIUS
DIFFERENCE13.7 DEGREES CELSIUS14.6 DEGREES CELSIUS12.5 DEGREES CELSIUS9.5 DEGREES CELSIUS

Architecture and Features of the Patented DPGA Process

DPGA stands for "Daiwa Process Global Advance." This is our own unique process that enables direct connection to copper bases.

The architecture that enables high heat dissipation capability (Example with high luminance LED):

  • Direct connection of the heat dissipation pad and copper base via a copper bump.
  • Heat conduction of copper enables high heat dissipation for the LED.

Architectural Differences

The direct connection of DPGA is the biggest difference from aluminum or CEM3 PCBs.

DPGA PCBs

Aluminum PCB

High conduction CEM3 or FR-4

Variations in Accordance with R&D Needs

  • Multi-layers on metal base
  • Insulation with separated copper base

Replacement of ceramic-based PCBs

Same or higher heat dissipation capability compared to ceramic PCBs

Copper Pin Inlay

Chips can be mounted on both surfaces.

Pin-point heat dissipation for heat-generating devices.

As this is not a press-fit of copper pins, there are no concerns about cracks or remaining toxic substances.

Consultation on copper pin size and shape is available.

Five Features of DPGA

  1. Direct connection enables high heat dissipation and high connection reliability.
  2. Copper bumps of various sizes and shapes can be created.
  3. A mixture of different sizes/shapes of bumps in one PCB is possible.
  4. Thin, lightweight, and high stiffness of the PCB.
  5. Most suitable for LEDs and in-vehicle PCBs.

Metal-Based PCBs

We manufacture high-quality aluminum or copper-based PCBs.

  • Heat conduction performance up to 10W.

High-Voltage PCBs (Thick Copper)

Thick copper can be used for both surface and/or inner layers.